Semiconductor stocks have been a mixed bag so far this year. In aggregate, they are beating the overall stock market’s return but the dispersion of returns is quite high.
Best New Companies To Invest In 2015: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Seth Jayson]
Advanced Semiconductor Engineering (NYSE: ASX ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:
Top 5 Semiconductor Companies To Buy Right Now: CSR PLC (CSRE)
CSR plc is an United Kingdom-based holding company. The Company is a provider of multifunction connectivity, audio, and location platforms. The Company is engaged in designing and supplying of integrated circuits (silicon chips) and multifunction platforms for a range of devices and applications that are used in a range of consumer electronics products. It operates in three segments: Automotive, Voice and Music and Consumer. Automotive segment includes automotive infotainment and portable navigation devices. Voice and Music segment representing all its audio products. Consumer segment includes gaming, home entertainment, personal computers (PCs), tablets, document imaging, health and fitness, and cameras. The Company�� subsidiaries include Cambridge Silicon Radio Holdings Limited and NordNav Technologies Aktiebolag. Advisors' Opinion:- [By reports.droy]
CSR (CSRE), which recently rejected a $2.5 billion takeover offer from Microchip Technology (MCHP), has just been bagged by Qualcomm Inc. (QCOM) for $2.5 billion.
Top 5 Semiconductor Companies To Buy Right Now: Advantest Corp (ATE)
Advantest Corporation, incorporated in December 1954, is a part of Advantest group. The Company operates in three segments: semiconductor and component test system segment; mechatronics system segment, focusing on peripheral devices including test handlers and device interfaces, and services, support and others segment. The semiconductor and component test system segment provides customers with test system products for the semiconductor industry and the electronic component industry. The mechatronics system segment focuses on peripheral devices to the semiconductor and component test systems. The services, support and others segment consists of comprehensive customer solutions provided in connection with the semiconductor and component test system and mechatronics system segments, support services and an equipment lease business.
Semiconductor and Component Test Systems Segment
Semiconductor and component test systems are used during the semiconductor and electronic component manufacturing process to confirm that a semiconductor functions properly. Semiconductor and component test systems consist of test systems for memory semiconductors and test systems for non memory semiconductors. Advantest�� test systems for memory semiconductors are test systems designed to test high-speed/high performance dynamic random access memory (DRAM) semiconductors used in equipment such as personal computers and servers, as well as flash memory semiconductors used in digital consumer products.
Test systems for memory semiconductors consist of a mainframe and one or more test heads. During testing, a device interface is attached to the test head. During the front-end testing process, wafers are loaded by a prober and are connected to the test system for memory semiconductors through the device interface. Electric signals between the die and the test systems for memory semiconductors are transmitted through probe pins located in the device interface and tested. After front-end te! sting is completed, the wafer is diced into separate dies and properly functioning dies are packaged. During back-end testing, test handlers are used to load these packaged devices onto the test heads, and electric signals are transmitted between the devices and the test heads via the device interface and tested. The test results are analyzed by the test systems for memory semiconductors��hardware circuits and software programs. Customized software programs for each semiconductor are required to analyze the semiconductor tests and test data.
Advantest�� main product lines of test systems for memory semiconductors are the T5500 series, the T5300 series and the T5700 series. The T5593 is a test system targeted at the market for high speed memory semiconductors, such as DDR2- Synchronous Dynamic Random Access Memory (SDRAM) and Synchronous Graphics Random Access Memory (SGRAM). The T5383 is a multi-functional test system for memory semiconductors that reduces testing costs for semiconductor manufacturers. Advantest�� main line of test systems for non memory semiconductors relates to test systems for SoC semiconductors, test systems for liquid crystal display (LCD) driver integrated circuits and test systems for semiconductors used in car electronics. The T6577 test systems for SoC semiconductors in the T6500 series were primarily developed to test micro controller unit (MCU) and SoC semiconductors that control digital consumer products at the production lines. The T6300 series are test systems for LCD driver integrated circuits used with high-definition LCD displays. The T7721, T7722 and T7723 are test systems for non memory semiconductors for mixed signal integrated circuits. The T8571A is a test system for non memory semiconductors that is primarily used to evaluate and analyze CCDs which are image sensors.
Mechatronics System Segment
The Main products in the Mechatronics System Segment are test handlers which handle semiconductor devices and automate the te! sting, an! d device interfaces which are the interfaces with devices being tested. Test handlers are used with semiconductor and component test systems to handle, condition temperature, contact and sort semiconductors and other electronic components during the back-end testing of the semiconductor manufacturing process. Advantest�� test handlers are sold primarily in conjunction with the sale of its semiconductor and component test systems. The M6242 test handler for test systems for memory semiconductors, including DDR-3SDRAM, can handle up to 512 semiconductors at a time. Advantest�� test handlers for non memory semiconductors, including SoC semiconductors, are the M4841, the M4741A and the M4742A, among others.
Advantest develops and manufactures device interfaces for semiconductor and component test systems and supplies device interfaces, such as high performance and high density connectors, socket boards and sockets. For test systems for memory semiconductors, Advantest provides motherboards capable of handling a maximum of 512 semiconductors at a time. For test systems for non memory semiconductors, Advantest provides motherboards that are compatible with a maximum of 3,072 signals. Advantest also provides motherboards designed for use in front-end testing. Advantest provides custom manufacturing of socket boards and performance boards for each device under test in accordance with customers��specifications.
Advantest provides sockets for test systems for memory semiconductors. Advantest provides low-inductance (0.4nH) sockets and fine pitch (0.4mm) sockets for semiconductors that are becoming more high-speed and more compact in size. Advantest provides carrying and contacting mechanism components compatible with each device under test for test handlers for memory semiconductors and test handlers for non memory semiconductors.
Services, Support and Others Segment
In the services, support and others segment, Advantest has focused on maintenance serv! ices, suc! h as installation and repair of Advantest�� products. It also focused on lease and rental services of its products as a part of Advantest�� effort to provide customers with comprehensive solutions.
The Company competes with Teradyne, Inc., Verigy Ltd., LTX-Credence Corporation, Yokogawa Electronic Corporation, FROM30 CO., LTD., EXICON Ltd., UniTest Inc., Delta Design, Inc., Seiko Epson Corporation, Mirae Corporation, TechWing, Inc., TSE Co., Ltd. and Secron Co., Ltd.
Advisors' Opinion:- [By Dan Carroll]
Nissan's done better this year than electronics maker Advantest (NYSE: ATE ) , but this stock absolutely blew up over the past week. Advantest's shares shot higher by more than 9%, wiping out pessimism over the company's weak earnings released a few weeks ago. Advantest's net loss and operating profit both fell below its guidance, and despite this week's investor optimism, the future's murky for this company. Financial site TheStreet downgraded the stock last week, citing Advantest's falling earnings, among other issues.
Top 5 Semiconductor Companies To Buy Right Now: Advanced Photonix Inc (API)
Advanced Photonix, Inc. (API), incorporated in June 22, 1988, is engaged in the development and manufacture of optoelectronic devices and value-added sub-systems and systems. The Company serves a variety of global original equipment manufacturers (OEMs) in a variety of industries. API supports its customers from the initial concept and design phase of the product, through testing to full-scale production. API has two manufacturing facilities located in Camarillo, California and Ann Arbor, Michigan. API is a supplier of optoelectronic semiconductors packaged into high-speed optical receivers, custom optoelectronic subsystems and Terahertz instrumentation, serving a variety of global OEM markets. API supports the customer from the initial concept and design of the semiconductor, hybridization of support electronics, packaging and signal conditioning or processing from prototype through full-scale production and validation testing. The target markets served by it are industrial sensing/NDT, military/aerospace, telecom, medical and homeland security. On March 1, 2013, it acquired certain assets of Silonex, Inc.
The Company�� high-speed optical receivers include avalanche photodiode (APD) technology and positive-intrinsic-negative (PIN) photodiode technology based upon III-V materials, including InP, InAlAs, and GaAs. Its optoelectronic subsystems are based on its silicon large area avalanche photodiode (LAAPD), PIN photodiode, FILTRODE detectors and light emitting diode (LED) assemblies. API�� Terahertz sensor product line is targeted at the industrial homeland security and military markets. Using its fiber coupled technology and high speed Terahertz generation and detection sensors, the Company is engaged in transferring Terahertz technology from the laboratory to the factory floor for use in non-destructive testing and real time quality control.
The Company competes with First Sensor, Illinois Tool Works, JDS Uniphase, Neophotonix, U2T and Nippon Electric.
Advisors' Opinion:- [By Patricio Kehoe]
In 2010, the company acquired privately held Nimsoft, a provider of IT performance monitoring solutions for $350 million in cash. In Sep 2010, CA signed a definitive agreement to acquire Hyperformix Inc. Recently; it acquired Layer 7 Technologies, a leading provider of Application Programming Interface (API) security and management. Furthermore, the acquisition of Arcot Systems Inc., a privately held company that provides authentication and fraud prevention software, in a move to boost its security offerings. These acquisitions have helped the firm to strengthen its cloud computing infrastructure and would also help to generate better profitability from the existing technology assets.
- [By Monica Gerson]
Advanced Photonix (NYSE: API) is expected to post a Q4 loss at $0.01 per share on revenue of $7.04 million.
Sport Chalet (NASDAQ: SPCHB) is projected to post its quarterly earnings.
- [By Bryan Murphy]
When most investors think of optical sensor makers, they tend to think of larger names like Honeywell International Inc.� (NYSE:HON) or Vishay Intertechnology (NYSE:VSH). And well they should. VSH is a $2 billion company, and HON is a $71.5 billion organization. The fact is, however, there are a few small cap stocks in the optical sensor space that are worth a look, and one of them is worth a very close look right now for a very clear reason... Advanced Photonix, Inc. (NYSEMKT:API).
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